Planatome, a medical device company that applies atomic-level polishing from the semiconductor industry to create advanced surgical blades that lead to better patient outcomes, announced the closing of its $5M Series A equity investment round. The company also announced that it secured an additional $1 million convertible venture debt commitment.

Founded in 2017 by leaders from the medical device and semiconductor industries, Planatome is a medical device technology company based in Phoenix, Arizona. The company has patented a surface modification technology based on chemical mechanical planarization (CMP); a process used in advanced semiconductor chip manufacturing. Currently, the company uses this proprietary polishing technology to create smooth, low trauma, high precision surgical blades.