Fabric8Labs today announced a $50 million funding round to expand its U.S.-based advanced manufacturing facilities, boosting capacity to produce tens of millions of components annually. Powered by its breakthrough Electrochemical Additive Manufacturing (ECAM) technology, Fabric8Labs is scaling up production of next-generation electronics components that enable leading-edge systems in thermal management (AI/HPC), wireless communications (RF), and power electronics. The U.S.-based manufacturing footprint enables customers to move seamlessly from prototyping to high-volume production.

Fabric8Labs has secured $50 million in its latest round of financing, led by NEA and Intel Capital, with participation from existing investors Lam Capital, the corporate venture arm of Lam Research Corp. (NASDAQ: LRCX), TDK Ventures, and SE Ventures, as well as new investors Marunouchi Innovation Partners, SK hynix, Ericsson Ventures, Masco Ventures, and Toppan Global Venture Partners.

Fabric8Labs is pioneering the next generation of manufacturing with its patented Electrochemical Additive Manufacturing (ECAM) 3D printing technology. Founded in 2015, the company delivers breakthrough solutions across electronics, medical devices, communications, and semiconductor industries. Fabric8Labs' ECAM technology empowers data center infrastructure, enabling advanced thermal management solutions, power management components, and semiconductor packaging.