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Cognichip Raises $60M Series A Round

2026-04-05
REDWOOD CITY, CA, Cognichip, the company pioneering ACIĀ® - Artificial Chip Intelligence - for semiconductor design, has announced an oversubscribed $60 million Series A financing.
The round was led by Seligman Ventures, with participation from SBI Investment and additional semiconductor-focused investors. All seed investors, including Mayfield, Lux Capital, FPV, and Candou Ventures, participated above pro rata allocations, bringing the company's total funding to $93 million. As part of the financing, Umesh Padval, Managing Partner at Seligman Ventures and former semiconductor company CEO, has joined Cognichip's Board of Directors. Lip-Bu Tan, CEO of Intel, who also participated in the round, joins Cognichip's Board of Directors.

Cognichip is developing the world's first Artificial Chip Intelligence (ACIĀ®) to reimagine chip design. Founded by experts from Amazon, Google, Apple, Aquantia, Synopsys, and KLA, the company tackles high cost and inaccessibility in chip development, enabling hardware to evolve as quickly as software innovation.
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