Eliyan, credited for the invention of the semiconductor industry's highest-performance and most efficient chiplet interconnect, today announced two major milestones in the commercialization of its technology for multi-die chiplet integration: the close of its Series A $40M funding round, and the successful tapeout of its technology on an industry standard 5-nanometer (nm) process.

Eliyan's Series A round was led by Tracker Capital Management ("Tracker Capital"), which was founded by Stephen A. Feinberg, Co-Founder and Co-Chief Executive Officer of Cerberus Capital Management, L.P. Celesta Capital and other strategic investors including Intel Capital and Micron also participated. As part of the investment from Tracker Capital, made in February 2022, Dr. Shaygan Kheradpir of Cerberus, former Group CIO and a founding member of the Executive Leadership Committee at Verizon, will join the Board of Directors of Eliyan.

Eliyan Corporation is leading the chiplet revolution, focusing on a fundamental challenge with scaling semiconductor performance, size, power, and cost to meet the needs of high-performance computing applications, from desktop to datacenter. It has developed a breakthrough method to enable the industry's highest performing interconnect for homogenous and heterogenous multi-die architectures using standard packaging substrates, enabling increased sustainability through reduction in costs, manufacturing waste and power consumption. The company's Bunch of Wires (BoW) technique, invented by founder Ramin Farjadrad and proven to increase performance by 2x and reduce power in half in advanced process technologies, provides a more efficient approach to developing chiplet-based architectures - which are the pathway to the continued scaling of Moore's Law.