TYLsemi is redefining how AI infrastructure silicon is built by delivering standards-based, production-ready chiplets purpose-built for modern multi-die systems. By combining chiplet design, packaging, integration and production expertise, TYLsemi provides a scalable, low-risk path to deploying advanced AI infrastructure. Customers can use TYLsemi chiplets as standalone components or as the foundation for full custom silicon. TYLsemi is expanding teams across silicon design, packaging, and systems engineering.

Key Contact

Funding Events

Date	Amount	Type	Investors	Valuation
07/15/26	$43,000,000	Seed	Egis Technology GHOVC Matter Venture Partners Viola Ventures	undisclosed