Eliyan Corporation is leading the chiplet revolution, focusing on a fundamental challenge with scaling semiconductor performance, size, power, and cost to meet the needs of high-performance computing applications, from desktop to datacenter. It has developed a breakthrough method to enable the industry's highest performing interconnect for homogenous and heterogenous multi-die architectures using standard packaging substrates, enabling increased sustainability through reduction in costs, manufacturing waste and power consumption. The company's Bunch of Wires (BoW) technique, invented by founder Ramin Farjadrad and proven to increase performance by 2x and reduce power in half in advanced process technologies, provides a more efficient approach to developing chiplet-based architectures - which are the pathway to the continued scaling of Moore's Law.
| Date | Amount | Type | Investors | Valuation |
|---|---|---|---|---|
| 11/08/22 | $40,000,000 | Series A |
Intel Capital L.P. Celesta Capital Micron Technology Tracker Capital Management  | undisclosed |
