MENLO PARK, CA, AttoTude, a leader of groundbreaking interconnect technology for AI and hyperscale data center applications, has announced the completion of its Series A funding round of $29 million.
This latest round comes on the heels of AttoTude's initial Seed Round which raised $11M in March, 2024. The rounds were funded by a combination of prominent investors, including Sutter Hill Ventures, Canaan Partners, and Wing Venture Capital.
AttoTude is a pioneer in the development of innovative interconnect technology for AI and hyperscale data center applications. The company is developing a differentiated technology for high-speed data networking that will break-through the limitations of the interconnect solutions that are used today, including significant improvements in bandwidth, power dissipation, reliability and cost.
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